Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817438 | System in package with interconnected modules | Hyoung Il Kim, Bilal Khalaf, Juan E. Dominguez | 2023-11-14 |
| 11552051 | Electronic device package | Florence R. Pon | 2023-01-10 |