Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848281 | Die stack with reduced warpage | Yong She, Bin Liu, Zhicheng Ding | 2023-12-19 |
| 11652087 | Interposer design in package structures for wire bonding applications | — | 2023-05-16 |