Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742284 | Interconnect structure fabricated using lithographic and deposition processes | Zhicheng Ding, Bin Liu, Yong She | 2023-08-29 |
| 11727354 | Systems and methods for initial item grouping logic | Xiaohua Cui, Quan Luo, Rubin Zhao | 2023-08-15 |
| 11699128 | Systems and methods for computer-determined efficient packaging determination | Xiaohua Cui, Rubin Zhao | 2023-07-11 |