| 11837641 |
Gate-all-around integrated circuit structures having adjacent deep via substrate contacts for sub-fin electrical contact |
Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Tahir Ghani +5 more |
2023-12-05 |
| 11830818 |
Semiconductor device having metal interconnects with different thicknesses |
Jui-Yen Lin, Nidhi Nidhi, Chia-Hong Jan |
2023-11-28 |
| 11824116 |
Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact |
Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Ayan Kar +5 more |
2023-11-21 |
| 11799009 |
Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact |
Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Tahir Ghani |
2023-10-24 |
| 11737362 |
Harvesting energy in an integrated circuit using the seebeck effect |
Jui-Yen Lin, Nidhi Nidhi, Chia-Hong Jan |
2023-08-22 |
| 11621334 |
Non-planar integrated circuit structures having asymmetric source and drain trench contact spacing |
Said Rami, Hyung-Jin Lee, Surej Ravikumar |
2023-04-04 |