Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837641 | Gate-all-around integrated circuit structures having adjacent deep via substrate contacts for sub-fin electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Tahir Ghani +5 more | 2023-12-05 |
| 11830818 | Semiconductor device having metal interconnects with different thicknesses | Jui-Yen Lin, Nidhi Nidhi, Chia-Hong Jan | 2023-11-28 |
| 11824116 | Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Ayan Kar +5 more | 2023-11-21 |
| 11799009 | Gate-all-around integrated circuit structures having adjacent structures for sub-fin electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Oleg Golonzka, Tahir Ghani | 2023-10-24 |
| 11737362 | Harvesting energy in an integrated circuit using the seebeck effect | Jui-Yen Lin, Nidhi Nidhi, Chia-Hong Jan | 2023-08-22 |
| 11621334 | Non-planar integrated circuit structures having asymmetric source and drain trench contact spacing | Said Rami, Hyung-Jin Lee, Surej Ravikumar | 2023-04-04 |