Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11837641 | Gate-all-around integrated circuit structures having adjacent deep via substrate contacts for sub-fin electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka +5 more | 2023-12-05 | $33,749,000 |
| 11824116 | Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact | Biswajeet Guha, William Hsu, Chung-Hsun Lin, Kinyip Phoa, Oleg Golonzka +5 more | 2023-11-21 | $28,968,000 |
| 11791331 | Integrated circuit structures including backside vias | Nicholas A. Thomson, Kalyan C. Kolluru, Adam Clay Faust, Frank O'Mahony, Rui Ma | 2023-10-17 | $15,641,000 |
| 11652107 | Substrate-less FinFET diode architectures with backside metal contact and subfin regions | Nicholas A. Thomson, Kalyan C. Kolluru, Nathan Jack, Rui Ma, Mark Bohr +2 more | 2023-05-16 | $11,130,000 |