Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791331 | Integrated circuit structures including backside vias | Nicholas A. Thomson, Kalyan C. Kolluru, Frank O'Mahony, Ayan Kar, Rui Ma | 2023-10-17 |
| 11694869 | Evaluating a contact between a wafer and an electrostatic chuck | Yosef Basson, Guy Eytan, Yonathan David | 2023-07-04 |