Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more | 2023-10-03 |