Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791169 | Dual step laser processing of an encapsulant of a semiconductor chip package | Pei Luan Pok, Roslie Saini bin Bakar, Chee Hong Lee, Swee Kah Lee, Yu Shien Leong +2 more | 2023-10-17 |
| 11587800 | Semiconductor package with lead tip inspection feature | Khay Chwan Saw, Chee Voon Tan | 2023-02-21 |
| 11569196 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Stefan Macheiner, Wae Chet Yong | 2023-01-31 |