Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587800 | Semiconductor package with lead tip inspection feature | Chau Fatt Chiang, Chee Voon Tan | 2023-02-21 |
| 11569196 | Chip to chip interconnect in encapsulant of molded semiconductor package | Chau Fatt Chiang, Stefan Macheiner, Wae Chet Yong | 2023-01-31 |