Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569196 | Chip to chip interconnect in encapsulant of molded semiconductor package | Khay Chwan Saw, Chau Fatt Chiang, Wae Chet Yong | 2023-01-31 |
SM
Stefan Macheiner
Overall (2023): #244,582 of 537,848Top 50%
1
Patents 2023