Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791169 | Dual step laser processing of an encapsulant of a semiconductor chip package | Pei Luan Pok, Roslie Saini bin Bakar, Chau Fatt Chiang, Chee Hong Lee, Yu Shien Leong +2 more | 2023-10-17 |
| 11682644 | Semiconductor device with a heterogeneous solder joint and method for fabricating the same | Sook Woon Chan, Fong Mei Lum, Joachim Mahler, Muhammad Muhammat Sanusi | 2023-06-20 |