Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682644 | Semiconductor device with a heterogeneous solder joint and method for fabricating the same | Swee Kah Lee, Sook Woon Chan, Fong Mei Lum, Muhammad Muhammat Sanusi | 2023-06-20 |