Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728310 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Shih-An Liao, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu | 2023-08-15 |
| 11710812 | Light-emitting device, manufacturing method thereof and display module using the same | Min-Hsun Hsieh, Hsin-Mao Liu | 2023-07-25 |
| 11588084 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Shih-An Liao, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu | 2023-02-21 |