Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728310 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Ying-Yang SU, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu | 2023-08-15 |
| 11588084 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Ying-Yang SU, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu | 2023-02-21 |
| 11578838 | Light emitting bulb | Chiu-Lin Yao, Min-Hsun Hsieh, Been-Yu Liaw, Wei-Chiang Hu, Po-Hung Lai +3 more | 2023-02-14 |