Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11808436 | Light emitting apparatus | Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong +4 more | 2023-11-07 |
| 11728310 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Shih-An Liao, Ying-Yang SU, Hsin-Mao Liu, Tzu-Hsiang Wang | 2023-08-15 |
| 11677057 | Light emitting device, light emitting module, and illuminating apparatus | Tzu-Hsiang Wang, Chen-Hong Lee | 2023-06-13 |
| 11588084 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Shih-An Liao, Ying-Yang SU, Hsin-Mao Liu, Tzu-Hsiang Wang | 2023-02-21 |