Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791370 | Light-emitting device | Min-Hsun Hsieh | 2023-10-17 |
| 11764328 | Light-emitting diode package having bump formed in wriggle shape | Ying-Yong Su, Wei-Shan Hu, Ching-Tai Cheng | 2023-09-19 |
| 11728310 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Shih-An Liao, Ying-Yang SU, Tzu-Hsiang Wang, Chi-Chih Pu | 2023-08-15 |
| 11710812 | Light-emitting device, manufacturing method thereof and display module using the same | Min-Hsun Hsieh, Ying-Yang SU | 2023-07-25 |
| 11594573 | Light-emitting structure having a plurality of light-emitting structure units | Chien-Fu Shen, Chao-Hsing Chen, Tsun-Kai Ko, Schang-Jing Hon, Sheng-Jie Hsu +5 more | 2023-02-28 |
| 11588084 | Method and structure for die bonding using energy beam | Min-Hsun Hsieh, Shih-An Liao, Ying-Yang SU, Tzu-Hsiang Wang, Chi-Chih Pu | 2023-02-21 |