Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778725 | Thermal interface material (TIM) filling structure for high warpage chips | Yongguo Chen, Yaotsan Tsai, Hua Yang | 2023-10-03 |
| 11778771 | Airflow control louver for bidirectional airflow cooling | Wei Qi, Yong Luo, Hua Yang | 2023-10-03 |
| 11758689 | Vapor chamber embedded remote heatsink | Yaotsan Tsai, Yongguo Chen, Hua Yang | 2023-09-12 |
| 11716836 | Electromagnetic compatibility gasket and vent | George Edward Curtis, John David Stallings | 2023-08-01 |
| 11586259 | Incorporating heat spreader to electronics enclosure for enhanced cooling | Joseph Jacques, John Scott Scheeler | 2023-02-21 |