Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778725 | Thermal interface material (TIM) filling structure for high warpage chips | Yongguo Chen, Vic Hong Chia, Hua Yang | 2023-10-03 |
| 11758689 | Vapor chamber embedded remote heatsink | Yongguo Chen, Hua Yang, Vic Hong Chia | 2023-09-12 |