Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778725 | Thermal interface material (TIM) filling structure for high warpage chips | Yongguo Chen, Yaotsan Tsai, Vic Hong Chia | 2023-10-03 |
| 11778771 | Airflow control louver for bidirectional airflow cooling | Vic Hong Chia, Wei Qi, Yong Luo | 2023-10-03 |
| 11758689 | Vapor chamber embedded remote heatsink | Yaotsan Tsai, Yongguo Chen, Vic Hong Chia | 2023-09-12 |