Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11586259 | Incorporating heat spreader to electronics enclosure for enhanced cooling | Vic Hong Chia, John Scott Scheeler | 2023-02-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11586259 | Incorporating heat spreader to electronics enclosure for enhanced cooling | Vic Hong Chia, John Scott Scheeler | 2023-02-21 |