Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676937 | Flexible sinter tool for bonding semiconductor devices | Jiapei DING, Rolan Ocuaman Camba, Jian Liao, Kar Weng Yan | 2023-06-13 |
| 11621181 | Dual-sided molding for encapsulating electronic devices | Yi Lin, Kar Weng Yan, Perez Angelito Barrozo | 2023-04-04 |
| 11548273 | Apparatus and method for removing a film from a surface | Ji Hao, Patrocinio Jr Go Torres, Kai WU, Moung Kai Kong | 2023-01-10 |