Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676937 | Flexible sinter tool for bonding semiconductor devices | Jiapei DING, Rolan Ocuaman Camba, Teng Hock Kuah, Jian Liao | 2023-06-13 |
| 11621181 | Dual-sided molding for encapsulating electronic devices | Teng Hock Kuah, Yi Lin, Perez Angelito Barrozo | 2023-04-04 |