Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676937 | Flexible sinter tool for bonding semiconductor devices | Jiapei DING, Teng Hock Kuah, Jian Liao, Kar Weng Yan | 2023-06-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676937 | Flexible sinter tool for bonding semiconductor devices | Jiapei DING, Teng Hock Kuah, Jian Liao, Kar Weng Yan | 2023-06-13 |