Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621181 | Dual-sided molding for encapsulating electronic devices | Teng Hock Kuah, Kar Weng Yan, Perez Angelito Barrozo | 2023-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621181 | Dual-sided molding for encapsulating electronic devices | Teng Hock Kuah, Kar Weng Yan, Perez Angelito Barrozo | 2023-04-04 |