Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11562925 | Method of depositing multilayer stack including copper over features of a device structure | Fuhong Zhang, Joung Joo Lee, Rui Li, Xiangjin Xie, Xianmin Tang | 2023-01-24 |