Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476293 | Manufacturing method of chip package | Yen-Shih Ho, Tsang-Yu Liu | 2022-10-18 |
| 11387201 | Chip package and manufacturing method thereof | Chia-Ming Cheng, Jiun-Yen LAI, Ming-Chung Chung, Wei-Luen SUEN | 2022-07-12 |
| 11355659 | Chip package and manufacturing method thereof | Chia-Ming Cheng, Wei-Ming CHIEN | 2022-06-07 |
| 11340679 | Uninterruptible power system testing method | Chung-Hsing Chang, Heng-Yi Cheng, Chien-Yueh Tung, Kun-Fu Lee, Chung-Chih Tseng | 2022-05-24 |
| 11310904 | Chip package and power module | Tsang-Yu Liu, Wei-Ming CHIEN | 2022-04-19 |