Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355659 | Chip package and manufacturing method thereof | Po-Han Lee, Chia-Ming Cheng | 2022-06-07 |
| 11310904 | Chip package and power module | Tsang-Yu Liu, Po-Han Lee | 2022-04-19 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355659 | Chip package and manufacturing method thereof | Po-Han Lee, Chia-Ming Cheng | 2022-06-07 |
| 11310904 | Chip package and power module | Tsang-Yu Liu, Po-Han Lee | 2022-04-19 |