Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476293 | Manufacturing method of chip package | Yen-Shih Ho, Po-Han Lee | 2022-10-18 |
| 11319208 | Chip package and manufacturing method thereof | Chaung-Lin LAI, Shu-Ming Chang | 2022-05-03 |
| 11310904 | Chip package and power module | Po-Han Lee, Wei-Ming CHIEN | 2022-04-19 |