Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521938 | Chip package including substrate inclined sidewall and redistribution line | Chia-Ming Cheng | 2022-12-06 |
| 11319208 | Chip package and manufacturing method thereof | Tsang-Yu Liu, Chaung-Lin LAI | 2022-05-03 |
| 11312995 | Method for detecting SNP site on SMA gene | Hung-Ming Chang, Chien-Hsing Lin | 2022-04-26 |