Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387201 | Chip package and manufacturing method thereof | Po-Han Lee, Chia-Ming Cheng, Jiun-Yen LAI, Ming-Chung Chung | 2022-07-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387201 | Chip package and manufacturing method thereof | Po-Han Lee, Chia-Ming Cheng, Jiun-Yen LAI, Ming-Chung Chung | 2022-07-12 |