Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387201 | Chip package and manufacturing method thereof | Po-Han Lee, Chia-Ming Cheng, Ming-Chung Chung, Wei-Luen SUEN | 2022-07-12 |
| 11309271 | Chip structure and manufacturing method thereof | Chia-Hsiang Chen | 2022-04-19 |