Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508642 | Power module package structure | TZE-YANG YEH, CHING-MING YANG | 2022-11-22 |
| 11430768 | Stacked die chip package structure and method of manufacturing the same | Chen Liu | 2022-08-30 |
| 11302601 | IGBT module with heat dissipation structure and method for manufacturing the same | TZE-YANG YEH, Chih-Hung Shih | 2022-04-12 |