Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430768 | Stacked die chip package structure and method of manufacturing the same | Tzu-Hsuan Wang | 2022-08-30 |
| 11385175 | Calibration method and terminal equipment of terahertz frequency band on-wafer S parameter | Yibang Wang, Aihua Wu, Faguo Liang, Peng Luan, Ye Huo +2 more | 2022-07-12 |
| 11340286 | On-wafer S-parameter calibration method | Aihua Wu, Chong Li, Yibang Wang, Xingchang Fu, Faguo Liang +3 more | 2022-05-24 |
| 11275103 | Calibration method, system and device of on-wafer s parameter of vector network analyzer | Yibang Wang, Aihua Wu, Faguo Liang, Xuefeng Zou, Zhifu Hu +2 more | 2022-03-15 |