Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11506458 | Enclosed heat sink with side wall structure | REUI-JEN YANG, TZE-YANG YEH | 2022-11-22 |
| 11508642 | Power module package structure | TZE-YANG YEH, Tzu-Hsuan Wang | 2022-11-22 |
| 11510342 | Immersion heat dissipation structure | CHENG-SHU PENG, TZE-YANG YEH | 2022-11-22 |