Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11506458 | Enclosed heat sink with side wall structure | CHING-MING YANG, REUI-JEN YANG | 2022-11-22 |
| 11508642 | Power module package structure | Tzu-Hsuan Wang, CHING-MING YANG | 2022-11-22 |
| 11510342 | Immersion heat dissipation structure | CHING-MING YANG, CHENG-SHU PENG | 2022-11-22 |
| 11469154 | IGBT module with heat dissipation structure having specific layer thickness ratio | SHIH-HSI TAI | 2022-10-11 |
| 11388811 | Heat-dissipating substrate structure with built-in conductive circuits | SHIH-HSI TAI | 2022-07-12 |
| 11302601 | IGBT module with heat dissipation structure and method for manufacturing the same | Tzu-Hsuan Wang, Chih-Hung Shih | 2022-04-12 |