Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302601 | IGBT module with heat dissipation structure and method for manufacturing the same | Tzu-Hsuan Wang, TZE-YANG YEH | 2022-04-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302601 | IGBT module with heat dissipation structure and method for manufacturing the same | Tzu-Hsuan Wang, TZE-YANG YEH | 2022-04-12 |