Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469154 | IGBT module with heat dissipation structure having specific layer thickness ratio | TZE-YANG YEH | 2022-10-11 |
| 11388811 | Heat-dissipating substrate structure with built-in conductive circuits | TZE-YANG YEH | 2022-07-12 |