Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527504 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2022-12-13 |
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2022-10-11 |
| 11348879 | Semiconductor structure | Rung-De Wang, Chen-Hsun Liu, Te-Hsun Pang, Chia-Hua Wang, Pei-Shing Tsai +1 more | 2022-05-31 |
| 11329124 | Semiconductor device structure with magnetic element | Chi-Cheng Chen, Hon-Lin Huang, Wei-Li Huang, Chun-Yi Wu, Chen-Shien Chen | 2022-05-10 |
| 11233116 | Semiconductor device structure with magnetic element | Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chen-Shien Chen | 2022-01-25 |