Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289455 | Backside contact to improve thermal dissipation away from semiconductor devices | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Yi-Shin Chu +1 more | 2022-03-29 |