Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437374 | Semiconductor device and stacked semiconductor chips including through contacts | Shaofeng Ding, Jihyung Kim, Jeong Hoon Ahn, Haeri Yoo, Yun Ki CHOI | 2022-09-06 |
| 11429777 | Methods of estimating warpage of interposers and methods of manufacturing semiconductor package by using the same | Wonji Park, Jeonghoon Ahn, Jihyung Kim, JaeHee Oh, Yunki Choi | 2022-08-30 |