Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538747 | Interposer structure, semiconductor package comprising the same, and method for fabricating the same | Shaofeng Ding, Jae-June Jang, Jeong Hoon Ahn | 2022-12-27 |
| 11476512 | Cooling efficiency-enhanced battery module and battery pack comprising same | — | 2022-10-18 |
| 11437374 | Semiconductor device and stacked semiconductor chips including through contacts | Shaofeng Ding, Minguk Kang, Jihyung Kim, Jeong Hoon Ahn, Haeri Yoo | 2022-09-06 |
| 11362380 | Electric vehicle battery pack cooling system and electric vehicle battery pack system cooling method using same | — | 2022-06-14 |