Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538747 | Interposer structure, semiconductor package comprising the same, and method for fabricating the same | Jae-June Jang, Jeong Hoon Ahn, Yun Ki CHOI | 2022-12-27 |
| 11437374 | Semiconductor device and stacked semiconductor chips including through contacts | Minguk Kang, Jihyung Kim, Jeong Hoon Ahn, Haeri Yoo, Yun Ki CHOI | 2022-09-06 |
| 11268140 | Delayed pyrophosphorolysis activated polymerization | Qiang Liu | 2022-03-08 |