Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538747 | Interposer structure, semiconductor package comprising the same, and method for fabricating the same | Shaofeng Ding, Jae-June Jang, Yun Ki CHOI | 2022-12-27 |
| 11469174 | Semiconductor device | Joon-Nyung Lee | 2022-10-11 |
| 11437374 | Semiconductor device and stacked semiconductor chips including through contacts | Shaofeng Ding, Minguk Kang, Jihyung Kim, Haeri Yoo, Yun Ki CHOI | 2022-09-06 |
| 11257754 | Semiconductor device | Joon-Nyung Lee | 2022-02-22 |