Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11429777 | Methods of estimating warpage of interposers and methods of manufacturing semiconductor package by using the same | Wonji Park, Jihyung Kim, JaeHee Oh, Yunki Choi, Minguk Kang | 2022-08-30 |