JW

Joy Watanabe

IT Invensas Bonding Technologies: 1 patents #12 of 18Top 70%
📍 Campbell, CA: #191 of 456 inventorsTop 45%
🗺 California: #24,623 of 65,961 inventorsTop 40%
Overall (2022): #389,647 of 548,613Top 75%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11296053 Direct bonded stack structures for increased reliability and improved yield in microelectronics Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more 2022-04-05