Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410962 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Benjamin L. McClain, Mark E. Tuttle | 2022-08-09 |
| 11410963 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Benjamin L. McClain, Mark E. Tuttle | 2022-08-09 |
| 11410973 | Microelectronic device assemblies and packages and related methods and systems | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2022-08-09 |
| 11302653 | Die features for self-alignment during die bonding | Wei Zhou, Christopher J. Gambee, Jonathan S. Hacker, Shijian Luo | 2022-04-12 |
| 11289440 | Combination-bonded die pair packaging and associated systems and methods | Kyle K. Kirby | 2022-03-29 |