Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527505 | Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology | — | 2022-12-13 |
| 11402426 | Inductive testing probe apparatus for testing semiconductor die and related systems and methods | Tony M. Lindenberg, Kurt J. Bossart, Chandra S. Tiwari | 2022-08-02 |
| 11302653 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Christopher J. Gambee, Shijian Luo | 2022-04-12 |