Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532578 | 3DI solder cup | — | 2022-12-20 |
| 11527436 | Microelectronic devices with through-substrate interconnects and associated methods of manufacturing | Kunal R. Parekh, Sarah A. Niroumand | 2022-12-13 |
| 11289440 | Combination-bonded die pair packaging and associated systems and methods | Bret K. Street | 2022-03-29 |
| 11239169 | Semiconductor memory stacks connected to processing units and associated systems and methods | — | 2022-02-01 |
| 11239207 | Semiconductor die stacks and associated systems and methods | — | 2022-02-01 |