| 11482504 |
Edge-notched substrate packaging and associated systems and methods |
Madison E. Wale, James L. Voelz, Dylan W. Southern |
2022-10-25 |
$11,361,000 |
| 11476241 |
Interposer, microelectronic device assembly including same and methods of fabrication |
Chan H. Yoo |
2022-10-18 |
$11,961,000 |
| 11462472 |
Low cost three-dimensional stacking semiconductor assemblies |
Chan H. Yoo |
2022-10-04 |
$12,913,000 |
| 11456284 |
Microelectronic device assemblies and packages and related methods |
Randon K. Richards, Aparna U. Limaye, Dong Soon Lim |
2022-09-27 |
$13,053,000 |
| 11444067 |
Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systems |
Chan H. Yoo |
2022-09-13 |
$11,426,000 |
| 11410973 |
Microelectronic device assemblies and packages and related methods and systems |
Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo, Bret K. Street +2 more |
2022-08-09 |
$10,590,000 |
| 11410981 |
Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer |
Chan H. Yoo |
2022-08-09 |
$10,590,000 |
| 11398465 |
Proximity coupling interconnect packaging systems and methods |
Rich Fogal |
2022-07-26 |
$15,302,000 |
| 11393794 |
Microelectronic device assemblies and packages including surface mount components |
Randon K. Richards, Aparna U. Limaye, Dong Soon Lim |
2022-07-19 |
$10,980,000 |
| 11393791 |
Three-dimensional stacking semiconductor assemblies with near zero bond line thickness |
— |
2022-07-19 |
$10,980,000 |
| 11386004 |
Memory device interface and method |
Brent Keeth, Chan H. Yoo, Roy Greeff, Matthew B. Leslie |
2022-07-12 |
$18,742,000 |
| 11362070 |
Microelectronic device assemblies and packages including multiple device stacks and related methods |
Aparna U. Limaye, Dong Soon Lim, Randon K. Richards |
2022-06-14 |
$13,168,000 |
| 11309285 |
Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same |
Chan H. Yoo, Mark E. Tuttle |
2022-04-19 |
$19,230,000 |
| 11276658 |
Devices with three-dimensional structures and support elements to increase adhesion to substrates |
Christopher J. Gambee, Nhi Doan, Chandra S. Tiwari, Ying Chen |
2022-03-15 |
$16,938,000 |
| 11264332 |
Interposers for microelectronic devices |
Chan H. Yoo |
2022-03-01 |
$21,169,000 |
| 11251516 |
Semiconductor device with tunable antenna using wire bonds |
Shijian Luo |
2022-02-15 |
$33,020,000 |
| 11239129 |
Package cooling by coil cavity |
Andrew M. Bayless, Wayne H. Huang |
2022-02-01 |
$13,825,000 |
