Issued Patents 2022
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482504 | Edge-notched substrate packaging and associated systems and methods | Madison E. Wale, James L. Voelz, Dylan W. Southern | 2022-10-25 |
| 11476241 | Interposer, microelectronic device assembly including same and methods of fabrication | Chan H. Yoo | 2022-10-18 |
| 11462472 | Low cost three-dimensional stacking semiconductor assemblies | Chan H. Yoo | 2022-10-04 |
| 11456284 | Microelectronic device assemblies and packages and related methods | Randon K. Richards, Aparna U. Limaye, Dong Soon Lim | 2022-09-27 |
| 11444067 | Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systems | Chan H. Yoo | 2022-09-13 |
| 11410973 | Microelectronic device assemblies and packages and related methods and systems | Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo, Bret K. Street +2 more | 2022-08-09 |
| 11410981 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Chan H. Yoo | 2022-08-09 |
| 11398465 | Proximity coupling interconnect packaging systems and methods | Rich Fogal | 2022-07-26 |
| 11393794 | Microelectronic device assemblies and packages including surface mount components | Randon K. Richards, Aparna U. Limaye, Dong Soon Lim | 2022-07-19 |
| 11393791 | Three-dimensional stacking semiconductor assemblies with near zero bond line thickness | — | 2022-07-19 |
| 11386004 | Memory device interface and method | Brent Keeth, Chan H. Yoo, Roy Greeff, Matthew B. Leslie | 2022-07-12 |
| 11362070 | Microelectronic device assemblies and packages including multiple device stacks and related methods | Aparna U. Limaye, Dong Soon Lim, Randon K. Richards | 2022-06-14 |
| 11309285 | Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same | Chan H. Yoo, Mark E. Tuttle | 2022-04-19 |
| 11276658 | Devices with three-dimensional structures and support elements to increase adhesion to substrates | Christopher J. Gambee, Nhi Doan, Chandra S. Tiwari, Ying Chen | 2022-03-15 |
| 11264332 | Interposers for microelectronic devices | Chan H. Yoo | 2022-03-01 |
| 11251516 | Semiconductor device with tunable antenna using wire bonds | Shijian Luo | 2022-02-15 |
| 11239129 | Package cooling by coil cavity | Andrew M. Bayless, Wayne H. Huang | 2022-02-01 |