Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515171 | Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices | Xiaopeng Qu, Hyunsuk Chun, Brandon P. Wirz | 2022-11-29 |
| 11410961 | Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assemblies | Brandon P. Wirz | 2022-08-09 |
| 11289360 | Methods and apparatus for protection of dielectric films during microelectronic component processing | Brandon P. Wirz, Wei Zhou | 2022-03-29 |
| 11239129 | Package cooling by coil cavity | Wayne H. Huang, Owen R. Fay | 2022-02-01 |